A continuous advanced assembly environment moving from a photonic integrated circuit through alignment, integration, bonding, packaging, test and functional system operation.

Device / PIC

Where light begins as a device.

Follow one photonic assembly from patterned device through alignment, integration, bonding, packaging and test.

Explore the technology Enter the assembly layer

The assembly layer

Photonic chips do not become systems by themselves.

Lasers, detectors, photonic integrated circuits, fibers, electronics, thermal interfaces and mechanical structures must be positioned, coupled, bonded, protected and verified with extraordinary precision.

Glass fiber array positioned at the polished edge of a photonic integrated circuit. — Conceptual editorial illustration · Precision alignment

Precision alignment

Microns become architecture.

In photonic assembly, micron- and sub-micron positioning errors can translate directly into coupling loss, making alignment part of system architecture rather than merely a final mechanical step.

Alignment, attach and bonding

Conceptual separated layers of a heterogeneous photonic stack before integration. — Conceptual editorial illustration · Heterogeneous integration

Heterogeneous integration

Different materials. One optical architecture.

Silicon, silicon nitride, III–V materials, electro-optic layers, detectors and electronics can each contribute what they do best. Assembly is the bridge between optimized parts and a coherent system.

Explore integration approaches

Conceptual photonic module in an open package under optical and electrical test. — Conceptual editorial illustration · Packaging and test

Advanced packaging

The package is part of the optical system.

Mechanical stability, fiber attach, thermal control, electrical interfaces and environmental protection are not finishing touches. They can determine whether a laboratory device becomes dependable hardware.

Where assembly requirements diverge

System landscape