01
01Architecture
Define optical, electrical, mechanical and thermal interfaces together; late coordination usually becomes an assembly penalty.
The assembly discipline
The precision layer between device and system.
Photonic assembly coordinates optical, electrical, mechanical and thermal interfaces that must work together within tightly managed manufacturing tolerances.
System discipline
Assembly is not one operation.
It is the coordinated sequence that preserves optical performance while the device acquires electrical access, mechanical stability, thermal control and environmental protection.
Working layers
Eight assembly disciplines. One performance budget.
02
02Optical alignment
Position fibers, lenses, waveguides and dies to maximize coupling while preserving a stable manufacturing window.
03
03Fiber attach
Choose geometry, adhesive or bonding sequence and strain relief around the optical tolerance—not after it.
04
04Die attach & bonding
Control placement, bond-line behavior, material compatibility and alignment drift during cure or thermal cycling.
05
05Heterogeneous integration
Combine materials and device layers selected for distinct optical, electronic or electro-optic functions.
06
06Packaging
Create a mechanical and environmental boundary without degrading coupling, heat flow or electrical access.
07
07Thermal & mechanical control
Manage expansion, stress, warpage and heat paths across materials that do not behave alike.
08
08Optical & electrical test
Measure interfaces and the assembled system, separating device limits from packaging-induced loss or drift.
Design for assembly
Every interface spends from the same tolerance budget.
Coupling geometry, surface condition, angular error and mode matching.
Datum strategy, stiffness, stress, vibration and dimensional stability.
Heat extraction, gradients, expansion mismatch and drift through operation.
Signal access, parasitics, grounding and testability around the photonic path.